跳至主要內容
新群科技
About Nutrim
Service
Temporary Bonding / Debonding Services
Filming on high warpage Wafer/Glass
Laser Mark Test
Products
EFEM
Wafer Inspection
Temporary Bonding and Debonding
Laser marker
Packaging Solutions
Processing Theories
半導體產業相關用語(中英)
Contact Us
選單
About Nutrim
Service
Temporary Bonding / Debonding Services
Filming on high warpage Wafer/Glass
Laser Mark Test
Products
EFEM
Wafer Inspection
Temporary Bonding and Debonding
Laser marker
Packaging Solutions
Processing Theories
半導體產業相關用語(中英)
Contact Us
Create a wonderful life with you.
靈活整合 需求至上
在 NUTRIM 新群科技,我們專注於技術創新及穩定生產做為努力的目標。通過專注於零缺陷和製造完美,為客戶提供最高品質的產品。
深入了解我們所做的努力
EFEM 整合
設備總覽
Temporary Bond & Debond Service
Packaging Solutions
About Nutrim
Automation Equipments
Contact Us
Products & Solutions >>>
Wafer LOADER
Open Cassette Type
FOUP Cassette Type
Wafer inspection
OM/IR/TM/ Inspection
Macro Inspection
temporary bond series
Bonder
Debonder
Debonder & Cleaner
OTHERS
Laser marker
Wafer Sortor
Packing & Unpacking
Wafer Mounter
UV Curing
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