Description
Description of this machine:
Wafer size
可支援最大晶圓尺寸到 12″。(可支援鐵框)
Wafer load/unload module
晶圓數片(Mapping)功能，可有效偵測有片、無片、錯片、凸片及疊片(晶圓無翹曲)
Aligner Module (Aligner)
- It can do micron-level precise alignment for transparent or non-transparent sheets.
- 自動對圓心，可依Notch、十字mark、特徵，做角度擺正。
Macro Inspection- The light source can be selected according to customer needs.
- For personnel to visually inspect the front, back, and back edges.
- The joystick can be adjusted manually, and the rotation angle can be adjusted arbitrarily. The inspection angle can also be set, and the angle can be automatically rotated and adjusted.
- Can do NG film records.
- The station can be selected and used according to the process.
Micro Inspection- 光學系統可依客戶需求搭配。(OM/IR/X-RAY)
- 可設定多點檢查點位。
- The station can be selected and used according to the process.
- 自動幾何量測功能：點、線、圓、弧、角度、間距、夾角、影像濾雜點等功能，並輸出量測報表。
- 晶圓自動擺正功能(±0.1°)。
- 遇晶圓翹曲時鏡頭可自動修正對焦。
- 自動選擇倍率。
- 可定點拍照。
- 具NG點重現性。
control element
PC BASE
Optional requirements ( Option )
- 晶圓翹曲片處理(<10mm)
- 支援 Mapping file 功能
- Wafer ID (OCR limited Semi standard font)
- 讀取Barcode/RFID/2D code
- 深度量測。
- 晶圓厚度量測。
- 跨境量測。
- 光學尺。
- 靜電解決方案。
- 資訊傳輸系統(SECS/GEM)
