Description
Description of this machine:
Wafer size
12″ 晶圓，可選擇8″、12″共用loadport。(可客製符合其他晶圓尺寸)
Wafer load/unload module
晶圓數片(Mapping)功能，可有效偵測有片、無片、錯片、凸片及疊片(晶圓無翹曲)
Aligner Module (Aligner)
- It can do micron-level precise alignment for transparent or non-transparent sheets.
- 自動對圓心，可依Notch、十字mark、特徵，做角度擺正。
Macro Inspection- The light source can be selected according to customer needs.
- For personnel to visually inspect the front, back, and back edges.
- The joystick can be adjusted manually, and the rotation angle can be adjusted arbitrarily. The inspection angle can also be set, and the angle can be automatically rotated and adjusted.
- Can do NG film records.
- The station can be selected and used according to the process.
Micro Inspection- Can do simple manual measurement.
- The joystick can be manually controlled to move the stage to any position for inspection.
- The electric stage can set multi-point inspection points and perform automatic inspection.
- The software can record NG points with reproducibility.
- The station can be selected and used according to the process.
control element
PC BASE
Optional requirements ( Option )
- 量測軟體升級成自動量測
- 軟體升級成AOI檢測
- 晶圓翹曲片處理(<10mm)
- 支援 Mapping file 功能
- Wafer ID (OCR limited Semi standard font)
- 讀取Barcode/RFID/2D code
- 深度量測。
- 晶圓厚度量測。
- 跨境量測。
- 光學尺。
- 靜電解決方案。
- 資訊傳輸系統(SECS/GEM)
