Description
Description of this machine:
Wafer size
8-inch wafer (can be customized to meet other wafer sizes)
Wafer load/unload module
- Lord port *2
- Use Open cassette
- 晶圓數片(Mapping)功能，可有效偵測有片、無片、錯片、凸片、疊片(無翹曲)
Aligner Module (Aligner)
- The center of the circle is automatically aligned, and the angle can be adjusted according to the Notch or the flat edge.
- It can do micron-level precise alignment for transparent or non-transparent sheets.
Macro Inspection- The light source can be selected according to customer needs.
- For personnel to visually inspect the front, back, and back edges.
- The joystick can be adjusted manually, and the rotation angle can be adjusted arbitrarily. The inspection angle can also be set, and the angle can be automatically rotated and adjusted.
- Can do NG film records.
- The station can be selected and used according to the process.
分片功能
- 具翻轉功能。
- Cassette A 原進原出。
- Cassette A 傳送至Cassette B
control element
PLC + HMI
Optional requirements ( Option )
- Warped sheet processing (<10mm)
- Wafer ID(OCR 限定Semi標準字型)。
- 靜電解決方案。
