Wafer Auto OM Inspection (Basic)

Fully Automatic Wafer Inspection Machine (Basic)

Reduces the chance that the operator will touch the wafer and cause the wafer to become dirty or damaged.

Advantages of this machine:

  • Developed and manufactured locally in Taiwan, which can reduce equipment costs for you.
  • The machine size is small, which can save the space of the clean room [1250(W)*800(D)*1170(H)].
  • Manual or automatic conversion can be done at any site.
  • Can do simple manual measurement.
  • With macro inspection (Macro) and micro inspection (Micro).
  • NG sites are reproducible.
  • The optical system can be adjusted as required.
  • Open architecture, the machine status can be observed at any time.

 

* This machine is a standard model, if you need more functions, please refer to our company's high-end wafer inspection machine, or do customized consultation.

 

Equipment category

Description

 Description of this machine:

 

Wafer size
  8-inch wafer (can be customized to meet other wafer sizes)

 

Wafer load/unload module
  • Use Open cassette 
  • Mapping function of wafers, which can effectively detect wafers, wafers, oblique wafers, convex wafers, and stacked wafers (no warpage)

 

Aligner Module (Aligner)
  • The center of the circle is automatically aligned, and the angle can be adjusted according to the Notch or the flat edge.
  • It can do micron-level precise alignment for transparent or non-transparent sheets.

 

巨觀檢測 ( Macro Inspection ) Macro Inspection
  • The light source can be selected according to customer needs.
  • For personnel to visually inspect the front, back, and back edges.
  • The joystick can be adjusted manually, and the rotation angle can be adjusted arbitrarily. The inspection angle can also be set, and the angle can be automatically rotated and adjusted.
  • Can do NG film records.
  • The station can be selected and used according to the process.

 

微觀檢測 ( Micro Inspection ) Micro Inspection
  • Can do simple manual measurement.
  • The joystick can be manually controlled to move the stage to any position for inspection.
  • The electric stage can set multi-point inspection points and perform automatic inspection.
  • The software can record NG points with reproducibility.
  • The station can be selected and used according to the process.
  • control element
    PLC + HMI

     

    Optional requirements ( Option )
    • Warped sheet processing (<10mm)
    • Wafer ID (OCR limited Semi standard font).

     

     

     

     

    relative devices

    error: Content is protected !!