Description
Description of this machine:
Wafer size
8-inch wafer (can be customized to meet other wafer sizes)
Wafer load/unload module
- Use Open cassette
- Mapping function of wafers, which can effectively detect wafers, wafers, oblique wafers, convex wafers, and stacked wafers (no warpage)
Aligner Module (Aligner)
- The center of the circle is automatically aligned, and the angle can be adjusted according to the Notch or the flat edge.
- It can do micron-level precise alignment for transparent or non-transparent sheets.
Macro Inspection
- The light source can be selected according to customer needs.
- For personnel to visually inspect the front, back, and back edges.
- The joystick can be adjusted manually, and the rotation angle can be adjusted arbitrarily. The inspection angle can also be set, and the angle can be automatically rotated and adjusted.
- Can do NG film records.
- The station can be selected and used according to the process.
Micro Inspection
- Can do simple manual measurement.
- The joystick can be manually controlled to move the stage to any position for inspection.
- The electric stage can set multi-point inspection points and perform automatic inspection.
- The software can record NG points with reproducibility.
- The station can be selected and used according to the process.
control element
PLC + HMI
Optional requirements ( Option )
- Warped sheet processing (<10mm)
- Wafer ID (OCR limited Semi standard font).